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USB 3.0 market takes off to create a complete ecosystem
USB3. 0 market seems to have finally taken off - recently, USB Design Forum (usb-if) has certified nearly 120 products meeting USB3.0 specification (superspeedsub).
2021-09-27
   

USB3. 0 market seems to have finally taken off - recently, USB Design Forum (usb-if) has certified nearly 120 products meeting USB3.0 specification (superspeedsub). USB3. The transmission rate of 0 can be changed from the original USB2 0's 480MB / s to 5g / s. Usb-if said that these certified products include motherboards, laptops, storage controllers, hard disks, pciexpress and separate chips. According to the prediction of International Research Institute IDC, in 2010, usb3 The demand for 0 chips is 12.45 million, and there is a chance to jump to 100 million in 2011. USB3. 0 can be described as "promising", and all kinds of people began to take turns to attack this new market of epoch-making transmission technology.

Intel action helps promote universal and

Recently, Intel announced at the fall Developer Forum (IDF) that in addition to the sandy bridge motherboard launched next year, it has determined to use usb3 0 is included in the reference design, and the westmer motherboard that will be mass produced and shipped in the fourth quarter will also have a built-in usb3 0 independent host control chip, which will help accelerate usb3 The popularity of 0.

Review USB2 0, USB2 0 technology was born in 2000, and its penetration rate exceeded 80% in just four years. USB2. The key to the rapid popularity of USB2.0 in the market lies in Intel's rapid integration of USB2.0 0 is imported into Nanqiao chip, so Intel's attitude is usb3 0 is the key to the rapid explosion of business opportunities. The cougarpoint chipset on Intel's new processor sandy bridge, which will be launched early next year, does not have a built-in usb3 0 host controller, which makes the industry complain. At present, many mainframe factories and notebook computer factories have put usb3 Column 0 is standard. Meanwhile, Intel's biggest competitor, AMD, also decided to launch the built-in usb3 in the second quarter of next year 0 controller, and will also cooperate with Renesas to introduce usb3 0 controller to the motherboard and officially fully imported into usb3 0 interface. In this case, Intel supports usb3 0 should follow the trend.

It is worth noting that lightpeak, the optical fiber transmission interface launched by Intel, has lagged behind because the specification has not been completed, and it is feared that it will not be launched until early 2012. Lightpeak will be similar to usb3 0 is the same connector. Intel also said that lightpeak and usb3 0 will coexist in the future and will not be in a competitive state.

Chip market resurgence

USB Dynasty change is imminent, attracting chip manufacturers to actively enter. Currently usb3 0 control chip market is divided into three parts, including host control chip, hub and device control chip.

In the past, large Japanese manufacturers occupied the mainstream of host chips, while American fresco logic launched usb3 for PCI Express II transmission interface in early June 0 two host side control chips, narrowing the distance with Japanese manufacturers. In addition, a number of chip factories in Taiwan announced a large-scale rush, including Ruisi authorized by Zhiyuan IP, ASUS xiangshuo, Weifeng and Yuchuang, subsidiaries of Weisheng, etc. According to the current progress, Taiwanese businessmen will ship a small amount of goods as soon as October.

The hub is usb3 0 development focus. It is an important bridge between host end and device end, and is also extremely important for the development of technologies at both ends. At present, the market is still controlled by Japanese manufacturers.

In terms of device side control chips, in addition to traditional Japanese and American manufacturers, IC design companies such as Chuangwei, Wangjiu, Anguo and qunlian in Taiwan have also invested one after another.

The market demand of device side controller lies in single chip, low cost and small size, with dual channel high read-write performance and can support as many types of flash memory as possible. Some Taiwanese businessmen began to change their strategies, focusing on USB 3.0 related to flash memory 0device control chip, from the best USB flash disk usb3 0 control chip. Among them, yincan usb3 0 chip has taken the lead in mass production, and Weifeng's new chip is also expected to be available in October. According to the industry, usb3 is currently on the market All 0U disk solutions use usb3 0-sataii bridge chip plus 1 SATA control chip makes the volume larger and requires other components, so the cost is high. Yincan and Weifeng launched a single chip solution, which can reduce the cost and make it easier to design.

And usb3 The bridge chip with large demand has become the most competitive battlefield at present. Fujitsu of Japan and lucidport of the United States have launched usb3 0-sata bridge chip, faradayelectronics and PLX will also launch their own usb3 0-sata bridge chip. Taiwan manufacturers including Weifeng, xiangshuo, yincan, Zhiwei and Chuangwei are also actively preparing for the war. It is reported that bridge chips are mainly used in external storage devices or optical drives, and may appear in portable devices, hard disk players and other products in the future.

Need to build a complete ecosystem

    USB3. 0 is a new specification after all, and faces many challenges. Building a complete ecosystem is the top priority. From the host side to the hub and then to the device side, it needs to be considered comprehensively. In terms of host side control chip, it is ten times higher than USB2 Transmission speed of 0, usb3 0 control chip must use more advanced process. Moreover, in addition to complex specifications and the need for usb1 0 and USB2 0 complete compatibility, but also need to meet the requirements of low power consumption and intelligent power management. Manufacturers should be cautious.

In the hub link, due to usb3 0 device will not use too many ports in the initial stage. In addition, if there are many ports, the power consumption will be high and the compatibility will be difficult to design. Therefore, it faces many design challenges, especially the usb-if compatibility test and the experience of future users.

    USB3. The development of 0device control chip is relatively easy, but at present, we are facing the situation of "a hundred schools of thought contend". We are either striving for mass production speed or driving down the price. Wei Junxiong, senior marketing manager of Chuangwei technology, said usb3 0's device chip products not only require low power consumption, low temperature and high performance, but also have usb3 0 and USB2 The compatibility of the two functions of 0 can not be ignored. However, due to the high price of host chip and the lack of popularity in the market, the development pace of device chip industry has been delayed.

At the same time, usb-if has not made a plan on how to carry out certification test in terms of important accessories such as connectors and hubs, and the work progress of usb-if still lags behind the market development. The construction of ecosystem requires the cooperation of usb-if, host factory, equipment manufacturer and chip factory to achieve win-win results.

If you want to know more about the connector industry and the latest market, please pay attention to Yangxun connector.

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